Internationale Partnersuche

Innovation & Technologie Anfrage

Seeking technology and experts in epoxy solder paste development

Country of Origin: Singapore
Reference Number: TRSG20200814001
Publication Date: 17 August 2020

Summary

A Singapore SME is seeking technology partners with the relevant technology and expertise to co-develop epoxy solder paste formulations as an alternative bonding material. The new bonding material can be applied to soldering components such as flexible circuits, display panels and in other electronics component manufacturing.

The SME is keen to seek partnerships in licensing, research or commercial agreements with technical assistance with startups and SMEs of all sizes.

Description

With the growing demand for flexible printed circuits and rigid-flex circuits, the electronic components market is seeing new generations of materials being used for soldering and bonding. New product requirements also require a shift in how soldering and bonding will be done. 



Novel epoxy solder paste formulations present an alternative bonding solution that can be applied to soldering components such as flexible circuits and display panels.



The Singapore SME, a soldering manufacturer is keen to explore the following partnerships with startups and SMEs of all sizes:



i) Licensing agreements

The Singapore SME will license the partner's technology to develop and commercialise it.



ii) Research cooperation

Both companies will jointly undertake research and further develop the technology.



ii) Commercial agreements with technical assistance 

The partner will provide technical support to the Singapore company with the establishment of a commercial agreement.

Expertise sought

The desired technical specifications of the epoxy solder paste are as follows:



- The flux and epoxy chemistries must be able to withstand the reflow process of 250⁰C.



- The epoxy residue will need to meet the minimum SIR (Surface Insulation Resistance) reading as set forth in the IPC J-STD 004 requirement.



- The performance of the bonding strength of the epoxy encapsulation must be at least 10% more than the company's existing product.



The relevant technology partner should be knowledgeable in flux and epoxy chemistries, with experience in chemical processing.

Stage Of Development

Prototype available for demonstration

Requested partner

The Singapore SME seeks the following types of partnerships with SMEs of all sizes.



i) Licensing agreement - The Singapore SME could license the technology and develop it further for commercialisation.



ii) Commercial agreement with technical assistance - The partner will provide support in the transfer of the technology with the provision of additional support services.



iii) Research cooperation agreement - The Singapore SME will provide support in the joint development of the technology.